Close to Lakefield: Intel and Foveros 3D Tech award-winning chip

The innovative Intel chip with the Foveros technology is the first of its kind.

With Foveros, processors are built in a completely new way: not with different IPs being distributed in two sizes, but with three-dimensional packaging. Think of a chip built like a layer cake (1 millimeter cm cake) compared to a chip with a more traditional pancake pattern.

Intel & # 39; s advanced Foveros technology installation technology allows you to "mix and move" IP blocks of various memory and I / O devices, all in a small physical package with a significantly reduced board size. The first product developed in this way is «Lakefield», an Intel® Core ™ processor with Intel hybrid technology.

At CES 2019, Intel Corporation expects a new platform code named "Lakefield." When it features hybrid CPU construction with Intel & # 39; s Foveros 3D installation technology. Lakefield has five cores, which combine Sunn Cove's 10nm high-quality core with Intel Atom processor-based cores into a motherboard of close and light devices full of performance, long battery life and communication. Intel shows how its technology is the foundation for the most important innovation and development in the world of CES 2019 from Jan.8-11 in Las Vegas. (Credit: Intel Corporation)

Industry analyst Linley Group recently named it Intel Foveros 3D stacking technology as the "Best Technology" at its 2019 Choice Analysts Awards.Our awards program not only recognizes the excellence in chip design and innovation, but also recognizes the products our products our analysts believe will have an impact on future projects, ”says Linley Group of Linley Gwennap.

Lakefield, a high balance of efficiency and efficiency

By itself, Lakefield represents a completely new class of chip. It provides the perfect balance of functionality and efficiency with the best communication in its category at the smallest size: the Lakefield package area measures 12 by 12 by 1 millimeter. Its hybrid CPU architecture includes low-power “Tremont” scalable “Sunny Cove” core fields of 10 nm to intelligently deliver product performance when needed and energy efficiency when not required for long-term battery.

Intel's customer platform, labeled "Lakefield", introduces the industry's first product with 3D integration and computing. With the latest 10nm process for Leveraging Intel and Foveros advanced installation, Lakefield offers OEMs a lot of flexibility for small and lightweight PCs. (Credit: Intel Corporation)

Gregory Bryant, senior president of Intel at the Client Computing Group, presents the "Lakefield" trust board during the Intel Corporation press conference at CES 2019 on Jan. 7, 2019, in Las Vegas. Lakefield features hybrid CPU construction with Intel & # 39; s Foveros 3D installation technology. Intel shows how its technology is the foundation for the most important innovation and development in the world of CES 2019 from Jan.8-11 in Las Vegas. (Credit: Walden Kirsch / Intel Corporation)

These advantages give the original equipment manufacturers limited flexibility for small and lightweight PCs, including emerging dual-screen sections and threatening PCs.

Recently, three projects have been announced that work with Lakefield and are being developed in partnership with Intel. In October 2019, Microsoft previewed the Surface Neo, which is a dual screen device. And later that month at a developer conference, Samsung announced the Glass Book S. Presented at CES 2020, it is expected that the Lenovo ThinkPad X1 Fold will be sold by mid-year.