The innovative Intel chip with the Foveros technology is the first of its kind.
With Foveros, processors are built in a completely new way: not with different IPs being distributed in two sizes, but with three-dimensional packaging. Think of a chip built like a layer cake (1 millimeter cm cake) compared to a chip with a more traditional pancake pattern.
Intel & # 39; s advanced Foveros technology installation technology allows you to "mix and move" IP blocks of various memory and I / O devices, all in a small physical package with a significantly reduced board size. The first product developed in this way is «Lakefield», an Intel® Core ™ processor with Intel hybrid technology.
Industry analyst Linley Group recently named it Intel Foveros 3D stacking technology as the "Best Technology" at its 2019 Choice Analysts Awards.Our awards program not only recognizes the excellence in chip design and innovation, but also recognizes the products our products our analysts believe will have an impact on future projects, ”says Linley Group of Linley Gwennap.
Lakefield, a high balance of efficiency and efficiency
By itself, Lakefield represents a completely new class of chip. It provides the perfect balance of functionality and efficiency with the best communication in its category at the smallest size: the Lakefield package area measures 12 by 12 by 1 millimeter. Its hybrid CPU architecture includes low-power “Tremont” scalable “Sunny Cove” core fields of 10 nm to intelligently deliver product performance when needed and energy efficiency when not required for long-term battery.
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Intel's customer platform, labeled "Lakefield", introduces the industry's first product with 3D integration and computing. With the latest 10nm process for Leveraging Intel and Foveros advanced installation, Lakefield offers OEMs a lot of flexibility for small and lightweight PCs. (Credit: Intel Corporation) -
Intel's customer platform, labeled "Lakefield", introduces the industry's first product with 3D integration and computing. With the latest 10nm process for Leveraging Intel and Foveros advanced installation, Lakefield offers OEMs a lot of flexibility for small and lightweight PCs. (Credit: Intel Corporation)
These advantages give the original equipment manufacturers limited flexibility for small and lightweight PCs, including emerging dual-screen sections and threatening PCs.
Recently, three projects have been announced that work with Lakefield and are being developed in partnership with Intel. In October 2019, Microsoft previewed the Surface Neo, which is a dual screen device. And later that month at a developer conference, Samsung announced the Glass Book S. Presented at CES 2020, it is expected that the Lenovo ThinkPad X1 Fold will be sold by mid-year.
