In a name change, the company has given its memory division a facelift, where it has formed the basis of the Company's operations. Under this new name, they want to develop a new era of memory products, which is defined by the increasing demands of storing users and companies, as we increasingly need to process big data and require greater capabilities and speed.
KIOXIA, the name by which you must continue to make history
Toshiba Memory Corporation has driven the emergence of flash memory technology since its inception back in 1987 (because, in case you didn't know, this type of memory was invented by them and we owe them the technology we have today). At present, the company has introduced a new technology under the name KIOXIA BiCS Flash, a 3D flash-layer memory type.
Along the way, we encountered several milestones achieved by the company: they were the first to produce the NAND memory in 1991, introducing the first chips 1GB NAND MLC in 2001, and were the first to announce products from 3D Flash memory In 2007. In 2012, they were able to present the highest density chips are on the market (128 Gb), and in 2014 they were the first to have 128 Gb NAND chips produced at 15 nm.
In other words, we owe this company many of the storage and memory technologies we use on a daily basis, and under the name of KIOXIA they continue to innovate to continue to improve their products, which end up being the standards of the industry we use every day.
3D BiCS FLASH Memory, the company's Flagship
We have already told you that Toshiba was the inventor of the Flash memory in 1987, and began its mass production in 1991. Since then, it has been slowly increasing the instability of the chips reducing the area's production. However, process migration is limited, presenting various challenges for manufacturers such as KIOXIA.
To solve this problem, they have developed a new technique in which memory heads are directly integrated, which we know as 3D Flash memory. In 2007, the company was the first to introduce products with this kind of memory, which came from the current BiCS Flash.
Population density and additional capacity
Three-dimensional (3D) embedded memory, BiCS Flash, has a much larger spatial resolution than the latest generation NAND flash memory. In addition, BiCS Flash reduced the chip size by optimizing the circuit technology and manufacturing process. It is currently manufactured under 96 layers, which is approximately 1.4 times the storage capacity of each physical space compared to 64 layer memory.
More speed, more reliability and less usage
Having well-integrated memory cells allows for wider spaces than normal 2D memory. This has enabled us to improve system speed by increasing the amount of data flow in each sequence, resulting in faster memory.
In the same way, this arrangement allows to reduce cell association, greatly improving the reliability since very small memory errors occur. As such, it has been possible to reduce the consumption significantly, because the bandwidth is very large and many data can be controlled simultaneously with the same power consumption.
KIOXIA is a brand name to follow
The company's name change represents a facelift that they want to show everyone that their greatest efforts continue to be new to the design of memory products.
And if what we told you about cHow to transform the industry over the years it seems a little to you, we won't have to wait too long for them to introduce new products leaving us all with our mouths open. From now on, KIOXIA is a name to keep in mind, as it will be the kind that defines new levels in the storage industry.
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