One of the big novelties of the last Peek performance event was the presentation of the M1 Ultra. a chip that was presented by surprise thanks to an interconnection systemalthough some have already sniffed out the possibility of this novelty months in advance.
A surprise that some have already seen coming
UltraFusion is the interconnect interface available to the M1 Max. An interface that Apple presented as something secret, although it seems that it was already discovered a few months ago. It is true that this does not detract from the M1 Ultra, capable of overshadowing the same Mac Pro, but it is one more example of how much we scan every movement of the brand at the apple in look for evidence and clues.
Do you see that or am I just crazy? The actual M1 Max die has an entire hidden section on the bottom that was not shown at all in Apple’s official renders of the M1 Max die. Just flip another M1 Max and connect it for an M1 Max Duo chip. Then use the I/O matrix for M1 Max Quadra. https://t.co/McWmofJAls pic.twitter.com/JogRwUGvF6
—Vadim Yuryev (@VadimYuryev) December 2, 2021
YouTuber Vadim Yuryev already suspected the possibility of connecting two M1 Max last December. As we can see in the tweet above, this the interconnect area was not present in the rendersbut it is clearly visible on the physical chip, where it appears as a blank area on the edge.
Hector Martin, a developer who, among other things, ports Linux to the Mac with Apple silicon, figured this out even earlier. At November 2021 tweeted that the connector interface was clearly designed to connect more than one chip, although at the time it served no purpose. He was so sure of his arrival that attempted to support functionality for Linuxbefore the official introduction of the M1 Ultra.
The developer even claimed, correctly for now, that if the combination of two M1 Max would be a reality, the combination of four of them would not happen. Something that we also cannot currently rule out, but which for now seems somewhat remote.
Hello community, my vision of #Apple Duo concept with a 3D animation before #AppleEvent
This shows us 2 M1Max dies and RAM chips on one package with die-to-die means and main die blocks. Thanks for retweeting 😊@vadim @LukeMiani @iCave_Dave @SnazzyQ @GregoryMcFadden @reneritchie pic.twitter.com/Ga3KkjFcxg— Fred the Frenchy (@Frederic_Orange) March 7, 2022
There are several examples of tweets like these, although we would like to highlight one more. Frenchman Fred and another YouTuber even created an animation of how UltraFusion works. A concept already had previously developed with great success.
As we have already started by saying, the discovery of this feature does not take anything away from Apple. It is true that this interconnection technology had not been brought to the attention of the general publicbut it is also true that by looking closely, more than one had noticed it.
