As is typical of AMD for each new release, the first ES CPUs come from a wide range EPYC. Milan, in Genoa because of its internal code it seems that at some points it won’t bring too many features, but for others we will be talking about a new twist on the part of Lisa Su.
Improvements in performance per watt, but not in standard main design
Zen 3 is reportedly going to be a lot more advanced, but it will keep the Zen 2 record high for others. The new EPYC processor line will come with a series called 7xx3 by the end of this year and despite the efforts of TSMC and AMD will not reveal the EUV process, but rather the next step in the original 7nm:
- N7P -> enhanced technique of real 7 nm which will give you the performance of FEOL (front-end-line) and MOL (finish line), so TSMC calculates that it can increase performance by 7% with the same power or reduce its usage by 10% in the same hours. It’s not an EUV lithographic process, though DUV, so there is no human development.
On the other hand, the rumors confirm that there will be no such advances in the formation of a cohesive nucleus, but the small objects that reflect the focus on the new coiled nucleus and the presence of surrounding nuclei. This should significantly reduce the total latency, in order to generate front-end y el back-end
Initial data from ES Zen 3, up to 3 GHz with 64 cores and 240 watts
Like in Rome, Milan has made the appearance thanks to 3 CPUs with A0 inputs showing two different configurations: 32 and 64. As happened again at that time, the samples reached maximum speed 3 GHz, and therefore the fact that there is no significant speed improvement other than a few MHz, and that any improvement will result from the gain of the structures, is considered.
The visualization of the Matisse Refresh CPUs can be a precursor to what AMD can show you with Zen 3, a series of processes where the frequency is not high or really simple, the integration is the same and so the performance of the input is noticeable.
Looking at the list of features, the IMC (Integrated Memory controller) seems to see no speed improvement or, cache size remains, but TDPs vary depending on the configuration. It’s funny how the 3-core 32-core ES achieves 200 watts of TDP pump with an average power consumption of 180W, while the 64-core version reaches 225W and 240 watts respectively.
We’ll have to wait for more details to come up about this new design so we can measure its performance compared to Zen 2.
