We will not go into the process of doing something as good as it is, because that would give a different story and would have to do too much. But what we will say and explain is the concept of the wafer itself, because it is important to understand everything that we will explain below.
Only one he is dead, also called Slice either Register, it's nothing like a very thin layer of semiconductor fabric, usually silicon, which has a circular shape in its manufacturing process and where chips will give life to our CPUs or graffiti cards.
Its hardness remains in its purity, since the material must be 99,99999 pure (known as 9N) and will be rebuilt and after a few procedures the circular sheets of a series of meters and of a certain size.
The size and size of the wafer determines the number of active chips
The first thing to consider is that the sizes and sizes we will describe are standard, since each function over the years has chosen its own method. Therefore, defining these measures as standard is not only complicated, but in some cases used by some companies and in others by others.
Sizes refer to their width, which is a unit of measure to refer to each type of wafer.
This allowed the size to increase as time went on, making each wafer more profitable, as larger the number of active chips could be produced.
The problem logically is to create files that are large in size but maintains the quality and purity of this. In addition, larger sizes have to be increased, which makes writing difficult, but allows for a greater number of layers at once.
Types of Wafer
It was 1960 when the first painting was created, and as a result, one would not expect too much from it. That year was a milestone that marked the new industry over the next 70 years. The first size was 23 mm, although their size is unknown, but should be very low, a few micrometers.
1962 and after the redesign of the deletion system 25 mm, where weight can also be determined, although it is believed that it will be on 130 microservices approx. Only one year later, in 1963, he did 28 mm thickness and through thickness the thickness increased as well, although there is no official data on it, since it was extremely difficult to measure at that time, but it was estimated that they would range between 180 micrometers to 190.
The first chips and semiconductors entered the market power and caused a revolution so the industry never stopped growing, until 1969 51 mm it has almost doubled in size in just six years. The magnitude can be estimated only (275 microseters).
With the industry completely focused on developing wafers, in 1972 they came up with a range 75 mm, where chip performance increased, thanks in part to the stability of the 375 microseter. The sector saw huge potential for wafers and growth rates remained relatively stable, because in 1976 bullets were introduced. 100 mm and 525 micrometers.
It was another step forward that helped the price of chips on a large scale and led to the growth of the industry. In 1981 the size increased to 125 mm and 625 microsettes, which meant an increase of 25% with one dead in just five years.
Inflation has hit the industry and its problems
Two years later and after a breath of fresh air that resulted 125 mm range, already in 1983 the industry reached 150 mm by wafer, citing the inch diameter as the simplest measure for designing wafers.
The fit was 6 inches and was achieved due to the size of the 675 micrometer.
The jump in size was about 20%, but was achieved in just two years. Beginning in 1983, both Intel and other inventors found the voting easy to solve, because they needed a new inventory process to keep increasing their size, moreover, the equipment needed a different processing to get dirty and of course, a lot of complexity to go along.
It took nine years to be quiet in 1992 when the trash cans were officially introduced 200 mm or 8 inches, where the size ranges from 675 feet to 725 microservices. Also, it meant a lot of profit and efficiency in the industry, but the decline was clear and there were no signs of improvement.
Ten years it took the industry to make the next evolutionary step in the eggs, where in 2002 these current ones appeared 300 mm or 12 inches, where once again the magnitude has risen 775 microservices. It was 50% profitable and it was back to pumping oxygen into the lungs of the industry.
The total cost was stratospheric, to the point that no one in the industry was able to fix it properly by adding the world's largest gains. It is believed that the figure is about 20 figures, something that was profitable for the 18-year-old receiving the same pots.
The future is uncertain, the most powerful processing and the capital's evolutionary connection
We are in the middle of 2020 and after years of promises and other promises, the industry has been unable to make big leaps despite the huge investment. At this point the number is unknown, but many analysts say the wafer is new 450 mm with 925 microservices They are money-hungry.
It can't be full again without looking at a specific date that has stopped your investment. The release date of these tablets it will not be before 2025, as the process under which they work requires a «culture» of silicon additives to be able to handle the tension and slip required in the cutting process.
There are rumors that the structural integrity of these plates is a major problem they face, because while some are able to stay perfect after the original cut, others suffer when working or managing, leaving them inactive.
The problem extends to the extent that it is possible to reach the physical limit of nanometers ahead of the physical limit of the wafers, so it is possible that the entire industry ends up allocating resources to creativity alone. of larger diameters instead of reducing the size of the transistors.
Table of Contents
