The problems that Intel sockets and processors have presented in recent years have made us understand that design is more important than we can think, and that it has a lot to do with the technical capabilities that a component is capable of offering us. This time, the company has learned from its mistakes, solving a big problem. issue which caused an increase in temperatures in CPU, and the solution comes from the new socket which Intel he created.
It is increasingly common to see processors reach higher temperatures due to the performance they offer, although in recent years we have seen that they have managed to stay between maximum temperatures of 70 to 100 degrees. But Intel has encountered a series of problems that have caused a sharp increase in the heat accumulated in its processors, overheating this component and causing problems for many users, although now, thanks to the new LGA1851 socket, This shouldn’t be such a big problem anymore.
We will be able to avoid IHS deformation in the new LGA1851 socket
Intel processors have had to suffer a fairly significant problem that affected the temperatures of their latest generations, the main cause being a poor socket design that caused the CPU IHS to warp in the central area when installed. This obviously prevents the heat sink from making contact as it should, leading to an increase in temperatures caused by poor design, making many computer enthusiasts overclocking were unable to take full advantage of their processors.
And the catch LGA1700 he has a ILM which puts enormous pressure on the central part, causing that deformation that we mentioned earlier and that cannot be solved in a simple way because it is a poorly planned design from the beginning. But one of the advantages of something going wrong is that you learn from your mistakes and you can use the experience to improve the design of the next socket you develop, which in this case is the LGA1851 and that will arrive with two different ILMs that motherboard manufacturers will be able to opt for.
The LGA1851 will have two types of ILM.
– Default ILM solution, similar to LGA1700. It is tilted at 2 degrees.
– Reduced Load ILM (RL-ILM), which is flat and offers improved thermal performance. It is covered by Intel warranty and is available as an option for system vendors
July 3, 2024 • 03:41
According to Intel, the new design that better distributes the pressure exerted by the ILM on the processor’s IHS will cost only $1 more to manufacturers who want to include it, which would allow them to include it in virtually all mid- and high-end cards, preventing them from bending when touching the contact plate of a heat sink. Intel has named this new design RL-ILM (Reduced Load ILM) and assures that it will be the solution for anyone who wants to use high-end cooling without having to worry about the problems it can cause in the IHS.
Intel’s next generation wants to reach a much higher point, offering users the ability to get the highest possible performance without having to worry about any issues that the socket design might have, although we have yet to see if the company has managed to solve other issues that they have related to the processor.
