It’s not a sudden revelation that Intel will abandon monolithic comps from its 14th Gen Intel cores. Thus, from Meteor Lake we will see that the processing units will be separated into different chips. It is clear that one of the strengths of this bet is the interconnectivity between the different parties. Something Intel explained when revealing its Meteor Lake at Hot Chips. Are you ready for Intel Core 14?
One of the most important advances of recent years that all hardware designers have made without exception is the development of new communication interfaces with the aim of reducing energy consumption in data transfer. Which increases as processors become more powerful. This has led to the use of new types of interconnects by different brands. Where in the case of Intel, Foveros and EMIB stand out, which we will see in future Intel processors, as well as in their graphics chips. And it is that the era of “chipitos” or also known as chiplets, is already a reality. In any case, looking at Intel’s launch schedule, we’re expecting it in the second half of 2023.
Intel will give new details about its Meteor Lake processors to Hot Chips
While waiting for Intel to launch the Intel Core 13 with Raptor Lake architecture, its successor is already heating up in the corner to be released sometime in 2023. This being a much deeper change by adopting the same philosophy that AMD took with the Ryzen 3000, 5000 and the future 7000. In other words, a processor in which instead of being made in one piece it will be in several. So far, Intel has shown us the two different variants of said processor. He did it at Computex and you can see the images below these lines.
The separation of the elements causes a series of latency losses and increased consumption that must be compensated for. This is where Foveros technology comes in. Which is 3DIC type. These types of interconnects are not new and consist of a chip we call Interposer that sits below the elements and performs the interconnect. However, Intel has never used it in a desktop processor until now. Luckily, when presenting Meteor Lake to Hot Chips, we’ll dispel any doubts about how well they managed to get the various parties to communicate.
The future Intel processor will consist of several different chips, which have not yet been described. From what we know we will have the so called Compute Die where the cores and cache will be and it will be made by Intel itself. Another of the chips will be the integrated graphics which will be manufactured at TSMC. As for the rest of the chips, it is not known where they will be manufactured and under which nodes. What we do know is that it will be the onboard memory controller for accessing RAM and peripherals.
