The maximum height of the LGA1200 is 8,249 mm, while that of the new LGA1700 socket is reduced to 7,532 mm, the minimums for their part are 7 312 for the first and 6,529 for the second. Or what amounts to the same, the maximum possible height for the new take is only the minimum of the previous one.
At best we comment on this millimeter, at worst something else. The problem is that the gap between the measurements of each socket is clean and normal for each one, since the pins will give more or less to the pressure and the anchoring of Foxconn. Understanding the contact problem due to this minimal and large distance and after obtaining the new anchors for LGA1700 with the corrected height, the tests did not wait and …
5 OAAs on trial, disaster looming
What has been tested reveals a difficult panorama to swallow at the moment, and is that the compatibility is not going to be as much as necessary, new anchors between the two. 5 different kits were presented with the correct application of thermal paste to verify the operation of each cold plate and the results were not good at all.
The AORUS Waterforce X360 This is undoubtedly the worst stopped, because there are multiple areas where there is no contact, while in the profiles it is maximized. This means that it is convex and that it does not press down in the center.
The CORSAIR H150i PRO Being a kit for LGA1200 with its new anchors for this socket, it has better contact, but there are two small areas where the thermal paste and cold plate are not touched. It is very improvable without a doubt.
The MSI P360 and C360 they are probably the most consistent and oddly enough the only ones to have a square cold plate. The contact is not perfect (a lot of paste on the edges and average IHS with light contact) but they seem competent, although they have small manufacturing flaws from what can be seen on the net.
The MSI 360R V2 he has an obvious problem with his anchoring, since there is an area where he touches too much and another where he is very subtle. This may be a fault during incorrect tightening or a round anchor too close to the overall dimensions, resulting in a pressure mismatch.
We finally see the ASUS ROG Ryujin 360, who clearly suffers from serious problems. First by the dimensions, at the limit of the IHS in terms of contact / size, then by a non-existent contact almost in the center of the IHS, which surprises and repeats almost the same errors as the AORUS, which indicates that it is possible that said anchor has problems in the area closest to the main VRMs.
Contact problems on Z690
Simple and straightforward: If you are planning to upgrade to Alder Lake-S and its platform, buy a new all-in-one or heatsink specifically designed for the LGA1700 and you will avoid temperature issues because what you will see will bring your CPU to 100º soon after putting a heavy load on it.
Finally, these contact problems could be extended, predictably, to the rest of motherboards with different chipsets, i.e. not only would the Z690 have contact problems, but the future B660, H670 and H610. .
