Cell phones are becoming more powerful, which usually means they are also more likely to heat up when performing heavy tasks. That’s why some devices have different cooling methods to ensure that the device doesn’t get too hot while in use.
Some, like the Samsung Galaxy S24, use vapor chamber cooling on plates inside the device. Others, like the REDMAGIC 9s Pro, use fan cooling, which makes let the air take care of cooling the mobile
Today, xMEMS, a chip company, launched the XMC-2400, a semiconductor fan that is just 1 mm high and promises to cool thin devices like smartphones and tablets. All this without using propellers, but thanks to its pressure pulse technology.
New cooling processor
As Android phones and tablets get thinner, manufacturers must find ways to find the perfect balance between power and heat dissipation. After all, high temperatures can damage the internal components of these devices, or even cause them to automatically shut down if they sense that this heat could put them in danger.
This microcooling chip is not the first of its kind, since there are other brands that also offer similar models, such as Frore. Its main difference is that in this case Excellent results are achieved with only 1 mm of height
How XMEMS Heat Sink Works
It achieves its function through ultrasonic modulation, which generates pressure pulses to move air, being able to move up to 39 cubic centimeters of air per second with 1,000 pascals of back pressure. It is a solid-state device, so unlike a conventional fan or heat sink, There are no propellers or moving parts that could be damaged,
The device has already been presented, and it wouldn’t be crazy if a manufacturer decided to integrate it into the construction of its smartphone. After all, it promises excellent performance in terms of heat reduction and occupies less than half the size of other alternatives.
