Here we must take into account different strategies that will be carried out over time, it is, say, a timeline like a roadmap where the players alternate according to Intel’s needs.
IDM 2.0, TSMC, Xe-HPC and arrears
The core IDM 2.0 strategy has brought something unexpected that we will see in a few months on the market: the new 6nm Xe graphics cards made precisely by TSMC. Many have wondered the reasons for this movement knowing that Intel now has its Intel 7 node and is operating at full capacity. The reality is that due to the complexity of creating the dies, due to the nullity of a sufficient number of EUV scanners and due to the price, it is more profitable for Intel to pay wafers and chips to TSMC than launching a product with Intel 7 or delay it directly.
Intel must go into battle now and it will be thanks to the Taiwanese, but it won’t be the only time they work together, at least according to what leaked today, since it is now known that TSMC will also manufacture. the iGPU at 3 nm for the blues in Meteor Lake processors.
This means that Raptor Lake as the 13th generation will be unchanged in terms of nanometers and will simply be an optimization of the lithographic process which will improve performance or consumption. It will be next year, but all eyes are on 2023, because that’s where all the news is.
Meteor Lake will be much more advanced
With this architecture we have to talk about mosaics, because it will have top notch vertical stacking technology. So the rumors of iGPU at 3 nm TSMC goes one step further and puts white on black for what you would expect. We know from Intel that iGPU Xe-LP 12.7 that Meteor Lake will have 192 execution units as a maximum configuration, that is to say a jump of more than double the performance at least, mainly due to what we now know of its 3 nm.
But they don’t stop there. P-Core cores will arrive with Redwood Cove microarchitecture, E-Core will go to Crestmont, both with node Intel 4 (old 7 nm and in competition with 5nm from TSMC), the iGPU Gen 12.7 with those mentioned TSMC 3 nm and the call SoC-LP which is equivalent to the AMD I / O die and which controls the IMC, PCIe and USB directly to the processor.
Well, this SoC will also be made by TSMC, but it’s not clear if it will have the N5 or the more advanced N4. Therefore, and to sum up, we have such a huge amount of data that only the maximum number of cores and threads of the high-end processor and the specific socket remains to be revealed. Could it be LGA1800? Or will Intel still change? If so, will it retain compatibility with the LGA1700 and LGA1800?
