Here we must take into account different strategies that will be carried out over time, it is, say, a timeline like a roadmap where the players alternate according to Intel’s needs. IDM 2.0, TSMC, Xe-HPC and arrears The core IDM 2.0 strategy has brought something unexpected that we will see in a few months on ...
The world’s largest foundry or chip factory, Taiwan Semiconductors, sees its dominance threatened by Intel’s announcement that it wants to compete with the Asian foundry and Samsung’s new nodes. TSMC has therefore developed N4P, a new manufacturing node in order to attract more and more new processor designs. There is no doubt that there is ...
Even if it doesn’t sound like it, investors, or at least their advisers, know what they’re doing when they decide to invest in one of the three companies mentioned. The problem is, it’s still debated which node is better and which is worse. We’re not going to get into this topic now, as we discussed ...
A few weeks ago, TSMC’s plans for the next few years began to be discussed. This company is responsible for the manufacture of chips inside Apple productsTherefore, any change can be critical. Mainly because it involves changes in their development, which generally lead to significant improvements. Apple Silicon will continue to achieve new levels of ...
If Intel now has a powerful ally like Qualcomm, TSMC continues to own Apple. The Taiwanese are aware of the non-dependence of the people of Cupertino beyond the short contracts they sign and it is a problem and surely a blessing when the signature is stamped. Intel has hit the gas and when it picks ...
We are still waiting for the 5nm node to be standardized on PC, which is what we expect by 2022. TSMC cannot sit idly by and must have its 3nm node ready. Which will start mass-producing chips from the second half of 2022. We already know that the first customers will be both Apple and ...
When we talk about liquid cooling, the first thing that comes to mind are the radiators integrated into the case of our PC. However, in recent years designs have been developed based on the vertical connection of components. What makes the thermal suffocation higher, it forces the designers to reduce the clock frequencies of their ...
User using the Procreate application. Image | iPlus Over the past few years, there has been a lot of talk about the manufacturing process for next generation iPhone processors. The iPhone 14 has been rumored to have a chip made using a 3-nanometer process, but that might end up not being the case. But the ...
AMD’s blow and surprise at NVIDIA has been manual and although the latter reacted in time, with each generation of GPUs they have more and more problems to tell the difference. AMD’s definitive move was intended to be an RDNA 3 architecture where Huang couldn’t explain the huge jump in performance, but it was all ...
Hardware shortages are a no-brainer, but in the case of AMD, the growing popularity of its APUs and CPUs in recent years has resulted in demand far exceeding the manufacturing capacity allocated to TSMC. So that the same does not happen to them again, AMD has already taken steps in this area. AMD secures space ...
